$WS_2$ powder was added to the Cu/Sn bond metal of diamond micro-blades for machining of semi-conductor and IC chips to improve cutting efficiency. The effect of $WS_2$ additive on cutting efficiency was investigated and compared with the micro-blades with $MoS_2$ developed in previous research. Flexural strength, frictional coefficient, and wear resistance of blades decreased with $WS_2$ but wear depth increased. It was found that the blades including $WS_2$ consumed less momentary energy than the blades containing $MoS_2$ during dicing test. Micro-blades containing $WS_2$ exhibited lower flexural strength than the blades with $MoS_2$ resulting from higher amount of sintering defects relevant to the less effectiveness of $WS_2$ on fluidity. The effect of $WS_2$ and $MoS_2$ on fluidity during sintering was analyzed in terms of mismatching degree between the longitudinal direction of lubricant particles and the perpendicular direction to the compact loading. The blade with 8.1 vol.% of $WS_2$ showed the best cutting efficiency.