This study analysis the effect of various temperatures (20, 35 and $50^{circ}C$) on the formaldehyde emission from wood composites, which were particleboard (PB), medium density fiberboard (MDF), high density fiberboard (HDF) and laminated HDF (L-HDF) by Japanese desiccator method. Also, to reduce formaldehyde emission by wood composites, it has been suggested that undergo a bake-out conditions. On average, the level of formaldehyde emission increased many times with a $15^{circ}C$ increase in temperature from 20 to $35^{circ}C$ for PB, MDF, HDF and L-HDF, respectively. Formaldehyde emissions from wood composites could be expected to increase with increasing ambient temperature. At $35$ for 28 days bake-out treatment of boards, the free formaldehyde emission reduced 67.8% (PB), 40.1% (MDF), 37.8% (HDF), and 35.2% (L-HDF). On the other hand, after the bake-out at $50^{circ}C$ for 28 days, the formaldehyde concentration decreased by 88.2, 66.9, 62.2 and 59.3% of the concentration before the bake-out for PB, MDF, HDF and L-HDF, respectively. An interesting of the bake-out treatment at $50^{circ}C$ after 14 days, formaldehyde emission grade of PB & MDF down $E_2$ to $E_1$, and HDF & L-HDF down $E_1$ to $E_0$.