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Development of Spring Unit to Reduce Drive Space and Thickness of IT Application and Its Experimental Verification
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  • Development of Spring Unit to Reduce Drive Space and Thickness of IT Application and Its Experimental Verification
  • Development of Spring Unit to Reduce Drive Space and Thickness of IT Application and Its Experimental Verification
저자명
Jeon. Yong-Phil,Seo. Hyung-Yoon,Kim. Jong-Deok,Kang. Chung-Gil
간행물명
International journal of precision engineering and manufacturing
권/호정보
2012년|13권 2호|pp.201-209 (9 pages)
발행정보
한국정밀공학회
파일정보
정기간행물|ENG|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

The size and design of a slider phone, which is one of the most important IT applications, are strongly affected by the deformation of the spring unit and the interface for PCB-to-PCB connection located in the same drive space. This implies that the components contribute to the enhancement of the degree of freedom in the design. Past technical developments have focused on thickness and cost reduction, but no fundamental research has been performed on the design. We propose a spring unit in which the interface is integrated with the spring unit in order to share the drive space. Finally, the degree of freedom of the H/W PCB artwork can be enhanced on the basis of the disposition of parts that have major functions. Therefore, a simplified spring that is capable of unifying the interface with the spring unit is proposed, and the type of interface appropriate for this study is identified. Finally, five spring unit samples are evaluated by testing the mechanical performance on the basis of the sliding force; further, reliability tests are performed to examine the life cycle, and environmental tests such as thermal shock and salt-spray tests are performed after assembling the spring unit of the mock-up phone.