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Improved interfacial stress analysis of a plated beam
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  • Improved interfacial stress analysis of a plated beam
  • Improved interfacial stress analysis of a plated beam
저자명
Hao. Sheng-Wang,Liu. Yan,Liu. Xiao-Dan
간행물명
Structural engineering and mechanics : An international journal
권/호정보
2012년|44권 6호|pp.815-837 (23 pages)
발행정보
테크노프레스
파일정보
정기간행물|ENG|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

A plated beam is strengthened by bonding a thin plate to the tension face; it often fails because of premature debonding of the thin plate from the original beam in a brittle manner. A sound understanding of the mechanism of such debonding failure is very important for the effective use of this strengthening technique. This paper presents an improved analytical solution for interfacial stresses that incorporates multiple loading conditions simultaneously, including prestress, mechanical and thermal loads, and the effects of adherend shear deformations and curvature mismatches between the beam and the plate. Simply supported beams bonded with a thin prestressing plate and subjected to both mechanical and thermal loading were considered in the present work. The effects of the curvature mismatch and adherend shear deformations of the beam and plate were investigated and compared. The main mechanisms affecting the distribution of interfacial stresses were analyzed. Both the normal and shear stresses were found to be significantly influenced by the coupled effects of the elastic moduli with the ratios $E_a/E_b$ and $E_a/E_p$.