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서지반출
Implementation and Analysis of an Automated Multiscale Measurement Strategy for Wafer Scale Inspection of Micro Electromechanical Systems
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  • Implementation and Analysis of an Automated Multiscale Measurement Strategy for Wafer Scale Inspection of Micro Electromechanical Systems
  • Implementation and Analysis of an Automated Multiscale Measurement Strategy for Wafer Scale Inspection of Micro Electromechanical Systems
저자명
Lyda. Wolfram,Burla. Avinash,Haist. Tobias,Gronle. Marc,Osten. Wolfgang
간행물명
International journal of precision engineering and manufacturing
권/호정보
2012년|13권 4호|pp.483-489 (7 pages)
발행정보
한국정밀공학회
파일정보
정기간행물|ENG|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

In this contribution the complete implementation of an automated multiscale measurement system (AMMS) for the inspection of micro lenses and micro electromechanical systems is presented. The system uses an adaptable active exploration strategy to balance the conflict between lateral resolution, axial accuracy and measurement duration. It is equipped with several sensors with different fields of view, resolutions and accuracies. The sensors are linked flexibly during the measurement process by image processing and data fusion algorithms. Image processing algorithms are used to identify defect indicators which represent possible unresolved defects in the current sensor scale. The information, gathered by the indicator algorithms, results in new regions of interest and knowledge about the specimen feature which is needed to select and to condition more finely scaled sensors, and to trigger higher resolved measurements in the next scale. For the automated adaption and parameter optimization of the system to a measurement task, an assistant system for sensor and algorithm selection is used. We present the necessary components for automatic task adaptation and active exploration of micro lenses and micro electromechanical systems (MEMS). Inspection results for MEMS-wafer and micro lens arrays and a performance analysis are discussed.