- 미세표면 평활화를 위한 진동 전기화학 폴리싱
- ㆍ 저자명
- 김욱수,김영빈,박정우,Kim. Uksu,Kim. Youngbin,Park. Jeongwoo
- ㆍ 간행물명
- 한국정밀공학회지
- ㆍ 권/호정보
- 2013년|30권 2호|pp.148-153 (6 pages)
- ㆍ 발행정보
- 한국정밀공학회
- ㆍ 파일정보
- 정기간행물| PDF텍스트
- ㆍ 주제분야
- 기타
This study demonstrates a novel hybrid surface polishing process combining non-traditional electrochemical polishing(ECP) with external artificial ultrasonic vibration. ECP, typical noncontact surface polishing process, has been used to improve surface quality without leaving any mechanical scratch marks formed by previous mechanical processes, which can polish work material by electrochemical dissolution between two electrodes surfaces. This research suggests vibration electrochemical polishing(VECP) assisted by ultrasonic vibration for enhancing electrochemical reaction and surface quality compared to the conventional ECP. The localized roughness of work material is measured by atomic force microscopy(AFM) for detailed information on surface. Besides roughness, overall surface quality, material removal rate(MRR), and productivity etc. are compared with conventional ECP.