The surface roughness and reflectivity of electroless-plated Sn-3.5 wt%Ag on a LED (light emitting diode) lead frame were investigated. Cu electroplating was carried out prior to electroless plating of Sn-3.5Ag to improve the reflectivity of the Sn-3.5Ag deposit. In order to investigate the effect of stirring speed and temperature of the plating solution, surface roughness and reflectivity was measured. The experimental results revealed that the thickness of the deposit layer increased with stirring speed and temperature of the plating solution. Stirring speed is increased from 100 to 300 rpm, the surface roughness was reduced from 0.513 to 0.266 ${mu}m$, and the reflectivity increased from 1.67 to 1.84 GAM. As temperature of the plating solution increased from 25 to $45^{circ}C$, the surface roughness reduced from 0.507 to 0.350 ${mu}m$, and the reflectivity increased from 1.68 to 1.84 GAM.