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Design of microspeaker module considering added stiffness
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  • Design of microspeaker module considering added stiffness
  • Design of microspeaker module considering added stiffness
저자명
Sun. Peng,Xu. Dan-Ping,Hwang. Sang-Moon
간행물명
Journal of mechanical science and technology
권/호정보
2014년|28권 5호|pp.1623-1628 (6 pages)
발행정보
대한기계학회
파일정보
정기간행물|ENG|
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이 논문은 한국과학기술정보연구원과 논문 연계를 통해 무료로 제공되는 원문입니다.
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기타언어초록

Mobile devices are becoming highly multi-functional due to the development of communication technology. The microspeaker module used in those devices, such as mobile phones or pads, is also playing important roles inside mobile devices. The conventional microspeaker modules normally have two demerits including a non-standardized total shape for different types of devices and a size too large for miniaturization design. This paper reports a novel structure design of a microspeaker module considering the added stiffness to minimize the total dimensions without affecting the acoustic performance. At the same time, a standardized novel microspeaker design was applied to different types of mobile devices with sustained performance. The finite element method (FEM) was applied for electromagnetic analysis and dynamic analysis. The respond surface method (RSM) was used for optimization. As a design result, the total volume was decreased by 51.8%. The simulation showed that compared to the conventional design, the novel design maintains the resonance frequency and sound pressure level (SPL) value. Prototypes were constructed and acoustic tests were conducted. The simulation results were verified experimentally. The results revealed the novel design to have a similar resonance frequency with conventional design. In addition, the mean SPL value from 800 Hz to 5 kHz for the conventional and novel designs were maintained with 94.33 dB and 94.98 dB, respectively, that means novel design has maintained acoustic performance as conventional design.