Biodegradable conductive composite films of polylactic acid(PLA) were prepared with various amounts of polyaniline(PAni) doped with dodecylbenzenesulphonic acid (DBSA) by solution blending technique to identify their mechanical and electric properties. 15 mol% of DBSA doped PAni was easily obtained by polymerizing of aniline in the presence of APS and DBSA in THF at $0^{circ}C$. FE SEM characterization showed that PAni were well spread on the PLA domains. The tensile strength of composite film with 15 wt% of PAni was significantly decreased from $565.3kg_f/cm^2$ for PLA film itself to $309.7kg_f/cm^2$. Elongations of all PAni/PLA composite films were also decreased up to 3-6%. Electrical conductivity of $2.9{ imes}10^{-3}$ S/cm could be achieved for the composite film containing 15 wt% of PAni-DBSA. Thermal stability of these composite films measured by thermogravimetric analysis(TGA) showed a slight decrease with the amount of PAni in PAni/PLA composite films at temperature lower than $300^{circ}C$. However, the final weight of char was strongly depended with the amount of PAni in original composite films. Conclusively, PAni/PLA composite films containing more than a 15 wt% of PAni could be used for intercepting electromagnetic and preventing electrostatic applications.