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- 한국전기전자재료학회(22)
- 한국정밀공학회(8)
- 대한기계학회(3)
- 대한전기학회(3)
- 한국반도체및디스플레이장비학회(2)
- 한국재료학회(2)
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- 한국탄소학회(1)
간행물
- 전기전자재료학회논문지(16)
- TRANSACTIONS ON ELECTRICAL AND ELECTRONIC MATERIALS(6)
- 한국정밀공학회지(5)
- INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING(3)
- 대한기계학회론문집. TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS. A. A(2)
- 반도체및디스플레이장비학회지(2)
- 전기학회논문지. THE TRANSACTIONS OF THE KOREAN INSTITUTE OF ELECTRICAL ENGINEERS. C/ C, 전기물성-응용부문(2)
- 한국재료학회지(2)
- CARBON LETTERS(1)
- JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY(1)
- KIEE INTERNATIONAL TRANSACTIONS ON ELECTROPHYSICS AND APPLICATIONS(1)
- 마이크로전자 및 패키징 학회지(1)
- 신뢰성응용연구(1)
- 한국세라믹학회지(1)
전체 선택해제
총 44건 검색
본문검색 결과만 보기
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Particle Image Velocimetry 기법을 이용한 CMP 공정의 Slurry유동 분석
김문기, 윤영빈, 고영호, 홍창기, 신상희, Kim. Mun-Ki, Yoon. Young-Bin, Koh. Young-Ho, Hong. Chang-Gi, Shin. Sang-Hee 한국정밀공학회 한국정밀공학회지 9 Pages
한국정밀공학회 한국정밀공학회지 2006, Vol.23 No.5 59-67 (9 pages)
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Preliminary Study on the Effect of Spray Slurry Nozzle in CMP for Environmental Sustainability
Lee. Hyunseop, Park. Yeongbong, Lee. Sangjik, Jeong. Haedo 한국정밀공학회 International journal of precision engineering and manufacturing 6 Pages
한국정밀공학회 International journal of precision engineering and manufacturing 2014, Vol.15 No.6 995-1000 (6 pages)
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Numerical Analysis of a Slurry Flow on a Rotating CMP Pad Using a Two-phase Flow Model
Nagayama. Katsuya, Sakai. Tommi, Kimura. Keiichi, Tanaka. Kazuhiro 한국정밀공학회 International journal of precision engineering and manufacturing 3 Pages
한국정밀공학회 International journal of precision engineering and manufacturing 2008, Vol.9 No.2 8-10 (3 pages)
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Study of Inhibition Characteristics of Slurry Additives in Copper CMP using Force Spectroscopy
Lee. Hyo-Sang, Philipossian. Ara, Babu. Suryadevara V., Patri. Udaya B., Hong. Young-Ki, Economikos. Laertis, Goldstein. Michael 한국전기전자재료학회 Transactions on electrical and electronic materials 6 Pages
한국전기전자재료학회 Transactions on electrical and electronic materials 2007, Vol.8 No.1 5-10 (6 pages)
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Dishing and Erosion Evaluations of Tungsten CMP Slurry in the Orbital Polishing System
Lee. Sang-Ho, Kang. Young-Jae, Park. Jin-Goo, Kwon. Pan-Ki, Kim. Chang-Il, Oh. Chan-Kwon, Kim. Soo-Myoung, Jhon. Myung-S., Hur. Se-An, Ki 한국전기전자재료학회 Transactions on electrical and electronic materials 4 Pages
한국전기전자재료학회 Transactions on electrical and electronic materials 2006, Vol.7 No.4 163-166 (4 pages)
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Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry
Kim. Tae-Gun, Kim. Nam-Hoon, Kim. Sang-Yong, Chang. Eui-Goo 한국전기전자재료학회 Transactions on electrical and electronic materials 4 Pages
한국전기전자재료학회 Transactions on electrical and electronic materials 2004, Vol.5 No.6 233-236 (4 pages)
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Polishing Mechanism of TEOS-CMP with High-temperature Slurry by Surface Analysis
Kim. Nam-Hoon, Seo. Yong-Jin, Ko. Pil-Ju, Lee. Woo-Sun 한국전기전자재료학회 Transactions on electrical and electronic materials 5 Pages
한국전기전자재료학회 Transactions on electrical and electronic materials 2005, Vol.6 No.4 164-168 (5 pages)
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CMP 가공된 사파이어웨이퍼의 웨이퍼내 표면전위에 관한 연구
황성원, 신귀수, 김근주, Hwang. Sung Won, Shin. Gwisu, Kim. Keunjoo 한국정밀공학회 한국정밀공학회지 7 Pages
한국정밀공학회 한국정밀공학회지 2005, Vol.22 No.2 46-52 (7 pages)
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슬러리 온도 및 유량에 따른 CMP 연마특성
정영석, 김형재, 최재영, 정해도 한국정밀공학회 한국정밀공학회지 7 Pages
한국정밀공학회 한국정밀공학회지 2004, Vol.21 No.11 46-52 (7 pages)