Temperature and atmosphere dependence of electrical conduction of the metal Cu, Ag, Au films, vaccum evaporated on glass, was investigated. The structural changes of the metal films were examined by SEM and high temperature XRD. The electrical resistance slightly increased with initial temperature increase up to the inflection point and decreased to minimum value, after this rapidly increased with further temperature increased below minimum. These phenomena were caused by the thermally induced film failure as a result of the mass transport. The temperature for the film failure increased in the order of O2, Air, Vacuum, N2, Ar in Cu, Ag films and Air, Vacuum, N2, Ar in Au film. The increase of resistance at the lower temperature range was attributed to the lattice distortion by disordered crystal structure, while the decreasing resistance was attributed to the removal of structural defects and film densification.