Cordierite based glass ceramics has become an electronic substrate material for electronic circuits and the use of whickers for improving strength and toughness is evident. Pure cordierite containing 15 vol.% silicon nitride were sintered by hot-prossing and it has above 99% density. Especially, it is assumed that toughening increasing at the more high sintering temperature relevants to the glass phase increasing, as showned in the roughness of the fracture surfaces. It was directionally dependent of whisker drirection during processing.