We investigated the effect of mechanical back side damage in Czochralski grown silicon wafer. The intensity of mechanical damage was evaluated by minority carrier recombination lifetime by laser excitation/microwave reflection photoconductivity decay method, degree of X-ray diffuse scattering, X-ray section topography, and wet oxidation/preferential etching methods. The data indicate that the higher the mechanical damage intensity, the lower the minority carrier lifetime, and the magnitude of diffuse scattering and X-ray excess intensity increased proportionally, and it was at Grade 1:Grade 2:Grade 3=1:7:18.4 that the normalized relative quantization ratio of excess intensity in damaged wafer was calculated, which are normalized to the excess intensity from sample Grade 1.