We evaluated the effect of processing variables on microstructural evolution interface irregularity between Ag sheath and superconductor core and resultant critical current density(J$_{c}$) of (Bi,Pb)$_2$Sr$_2$Ca$_2$Cu$_3$O$_{x}$(2223) superconductor tape. The value of J$_{c}$ was significantly influenced by the interface irregularity, degree of texturing and relative 2223 content. The interface became more irregular(sausage effect), while the degree of texturing gradually improved as the dimension of tape decreased during forming process. As the dimension of wire/tape were changed from diameter of 3.25 mm to thickness of 0.20 mm, J$_{c}$ value was observed to be increased by 10 times. In addition, optimum sintering temperature for improved J$_{c}$ was observed to be 835$^{circ}C$ in a ambient atmosphere probably due to combined effect of both improved texturing and high 2223 content. Microstructural investigation showed the degree of texturing was degraded by the existence of both second phases and interface irregularity. It was observed that larger grain size and better texturing was developed near relatively flat interface compared to those inside superconducting core.ting core.