In this paper, methods to analyze wire sweep and paddle shift during the semiconductor ship-encapsulation process have been studied. The analysis of wire sweep includes flow-field analysis in a complicated geometry, drag-force calculation for given flow of fluid, and wire-deformation calculation for given loads. The paddle-shift analysis is used to analyze the deformation of the paddle due to the pressure difference in two cavities. the analysis is done using either analytical solutions or numerical simulation. The analytical solution is used for rough but fast calculation of wire sweep. The numerical solution is used for more accurate calculation of wire-sweep. The numerical results of wire sweep show good agreements with the experimental ones.