The temperature uniformity on a heat pipe hot chuck (HPHC) during semiconductor wafer processing has been an important factor to critical dimension (300 mm) uniformity as the feature size of semiconductors decreases and productivity density increases due to the new process of nano size special manufacturing technology. To design the present heat pipe hot chuck system, which has enhanced temperature uniformity for the wafer process, the heat distribution of the system was analyzed experimentally with various working fluids such as water, $TiO_2$, ATO, ITO, $Al_2O_3$, and Ag-nanofluids and 8 cell structures. Unlike the conventional solid state chuck, the present heat pipe hot chuck system consists of a heat pipe containing specially charged working fluid. Various working fluids have been tested to find best temperature uniformity feature on the top surface of hot chuck. $TiO_2$-nanofluid was used and tested as the working fluid of the heat pipe hot chuck system in this paper. The temperature uniformity of upper surface was sustained in the range of $pm1^{circ}C$. A nano-porous layer was observed on the surface with the good result of surface temperature uniformity compared with distilled water.